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UMW-Ultrashort Pulse Micromachining Workstations

UMW Femtosecond Workstation
Next-Generation Femtosecond Micromachining Workstations

With over 30 years of expertise in ultrashort pulse lasers and hundreds of real-world applications, we’ve perfected the art of precision micromachining. Our latest UMW-Series workstations bring together cutting-edge technology and decades of processing experience to deliver unmatched performance.

All-in-One Micromachining Solution

The UMW-Series provides everything you need to start micromachining with ultrashort-pulsed lasers. Designed from years of hands-on experience, these workstations integrate the ideal combination of components, performance parameters, and software—ensuring precision, efficiency, and reliability.

Advanced Features & Seamless Control
  • Customizable Beam Delivery – Ample space for flexible beam manipulation and integration.
  • Precision Machine Vision & Inspection – A sophisticated system for real-time monitoring and accuracy.
  • Intuitive Software Interface – Modern graphical design with seamless control of all system components.
  • CAD File Integration – Direct import of CAD, Gerber, and NC Drill files, along with built-in drawing tools.
  • Smart Editing & Hatch Options – Manipulate imported CAD files within the user interface and apply various hatch patterns to closed regions.

Ready to explore the full capabilities of the UMW-Series? Contact our sales team today for details!

UMW-Series: Fully Integrated Precision Micromachining Workstations

Engineered for unmatched precision and control, the UMW-Series offers a comprehensive suite of cutting-edge features to optimize ultrashort-pulse laser micromachining.

Key Features

  • Proven Laser Technology – Choose from CPA-Series or IMPULSE Family, renowned for reliability and performance.
  • Advanced Motion Control – Multi-axis CNC positioning system ensures accuracy in every process.
  • Optimized Beam Delivery – Designed for maximum efficiency and precision.
  • Intelligent Processing Parameters – Computer-controlled selection for seamless operation.
  • Class I Enclosure – Provides a safe and compliant working environment.
  • Integrated Machine Vision & Inspection – On-axis system for real-time monitoring and enhanced quality control.
  • Customizable Pulse Control – “On-demand” pulse selection, from 1 to 64,000, at user-defined repetition rates.
  • Versatile I/O Options – Optional digital and analog input/output configurations.
  • Precision StabilityGranite base mounted on pneumatic vibration isolators for ultra-stable processing.
  • Flexible User Area – Space allocated for beam manipulation and diagnostics.
  • Industry-Compliant Certification – Meets NFPA, IEC 60825-1, SEMI S2, SEMI S8, and SEMI S14 standards (model specific).

 

Elevate your micromachining capabilities with UMW-Series technology.

Positioning System
Stage Travel (X, Y): Up to 300 mm x 300 mm
Stage Performance (X, Y): Application specific
Beam scan head Optional multi-axis beam scanner
Dynamics Z-axis: up to 100 mm max travel
Configurations: Fully configurable options up to 7 axis available
Vision System
Lighting: On-axis LED illumintated vision system, Secondary off-axis and Ring lighting optional
Functions: Pattern/Feature recognition, Edge location, Part measurement, Autofocus, Alignment, Autotomatic part rotation
Laser
Impulse Family or CPA Series laser
Enclosure
Class 1 laser enclosure
Examples of UMW Application

Unlock new possibilities with ultrafast laser technology, enabling precision, efficiency, and material versatility across a wide range of industries.

Key Applications:
  • Precision Microhole Drilling – Create ultra-fine holes with extreme accuracy in metals, ceramics, and polymers.
  • High-Precision Microcutting – Achieve intricate cuts with minimal thermal impact, ideal for delicate materials.
  • Surface Modification & Structuring – Enhance material properties with controlled texturing and functional surface features.
  • Precision Micromilling – Shape microstructures with sub-micron accuracy for advanced manufacturing needs.
  • Material Ablation – Remove layers with exceptional precision, ensuring clean and efficient processing.
  • Micromarking & Identification – Engrave durable, high-resolution markings for traceability and branding.
  • 3D Tomography – Perform high-resolution imaging and analysis for in-depth structural insights.

Discover how femtosecond laser micromachining can transform your applications.

Contact us today to learn more!

UMW-Series Datasheet
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